Reflow Touch Screen BGA Rework Station
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Price:
Negotiable
- minimum:
- Total supply:
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Delivery term:
The date of payment from buyers deliver within days
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seat:
Beijing
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Validity to:
Long-term effective
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Last update:
2023-09-05 13:52
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Browse the number:
308
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- Contactaixin:
dinghua(Mr.)
- Email: telephone: phone:
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Arrea:
Beijing
Address:4th Floor, Building 6B, Shengzuozhi Technology Park,Xinqiao(518125),Bao'an,Shenzhen, Guangdong, China.
- Website:
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                                     Reflow Touch Screen BGA Rework Station
 Product application of reflow bga rework station DH-C1
The Reflow Touch Screen BGA Rework Station is a high-tech device used for reworking and repairing surface-mountÂ
technology (SMT) components, including ball grid array (BGA) chips. It features a touchscreen interface for easyÂ
the operation, a powerful heating system, precise temperature control, and multiple safety features to ensure the integrity
 of delicate parts during rework.
The device uses a combination of infrared and hot air heating technologies to melt the solder balls on the BGA chip,Â
allowing it to be removed and replaced on the printed circuit board (PCB). Its touchscreen interface allows theÂ
operator to set precise temperature and heating profiles, while the built-in thermocouple ensures accurate temperature
 measurement.
The Reflow Touch Screen BGA Rework Station also features a built-in vacuum pump to aid in the removal of theÂ
BGA chip, and a powerful cooling fan to prevent damage to the PCB or surrounding components. Its safety featuresÂ
include automatic overheating protection, short circuit protection, and a warning alarm to alert the operator of anyÂ
issues during the rework process.
2. Product specification of reflow bga rework station DH-C1
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3. Product advantages of reflow bga rework station DH-C1
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4. Product details of reflow bga rework station DH-C1Â
Flexible delivery :By DHL, TNT, FEDEX, Air shipping, Sea shipping and Land transportation etc. taking 3~30Â
days to arrive at destination according to different shipping ways.
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7. Contact us for more details of BGA rework station
Scan the QR code to save the contact
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8.Learn something related about BGA
Advantages of BGA :
• Improved PCB design as a result of lower track density.
• The BGA package is robust.
• Lower thermal resistance.
• Improved high speed performance and connectivity.
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What's the difference between LGA, BGA, and PGA sockets?
LGA is Land Grid Array. PGA is Pin Grid Array. BGA is Ball Grid Array.
LGA is what you're going to get right now. The CPU has metal contacts flush on the surface, pins in the socket.
PGA is the other way around. The pins are on the chip.
BGA is for CPUs that will be soldered into place (think laptops and consoles).
LGA are desktop sockets.
BGA are laptop sockets where the CPU is soldered to the board.
PGA are laptop sockets where the CPU may be able to be removed.
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